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BGA Rework Station

     
 

BGA Rework Station ZM-R380C

 
Specifications

BGA Rework Station ZM-R380C
1.Total power 3000W
2. Top heater 800W
3. Bottom heater 2000W

Specifications:
Features:
1. Choose imported high-precision materials (temperature sensor, PLC, heater) to control the BGA desoldering & soldering   procedures precisely.

2. Top & bottom temperature areas heat independently, And it can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at the same time.

3. Choose imported high-precision thermocouple to detect top/bottom temperature precisely.

4. Top & bottom heaters can be controlled independently by the temperature graphs. A cross-flow fan cools rapidly to protect the PCB from deformation when welding.

5. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering.

6. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB.

7. For large thermal capacity of PCB or other high-temperature and lead-free welding requirements, all can be handled easily.

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Specifications of ZM-R380B: 

Specifications

BGA Rework Station ZM-R380B
BGA chips Desoldering and soldering
Simple and easy to operate
High quality with good price
CE

1. Total power: 3000 W
2. Top heater: 800 W
3. Bottom heater: 2000 W
4. Power supply: single-phase 220 VAC 50/60Hz 3KVA
5. Machine Dimension: 450 × 380 × 580mm
6. Temperature control: high-precision K Sensor
7. Positioning: V-groove for PCB positioning, Max PCB size: 300 × 320mm
8. Weight: About 25 KG

Main Features: 

1. Choose imported high-precision materials (temperature sensor, PLC, heater) to control the BGA desoldering & soldering procedures precisely.

2. Top & bottom temperature areas heat independently, And it can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at the same time.

3. This machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and a proprietary software attached to it.

4. Choose imported high-precision thermocouple to detect top/bottom temperature precisely.

5. Top & bottom heating can be controlled independently by the temperature graphs. A cross-flow fan cools rapidly to protect the PCB from deformation when welding.

6. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering.

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ZM-R5850 bga rework station

Specifications:
1.Total power: 4.2KW
2.Top heating power: 800W
3.Bottom nozzle power: 800W
4.Infrared power: 2400W
5.Power supply: Single phase220V/230V   50/60Hz   4.5KVA
6.Machine dimensions: 450*550*650mm
7.Temperature control: High precision K-type sensor
8.Positioning: V-groove for PCB positioning.
9.Max PCB size: 280*395mm
10.Weight: About 30KG

Features:
1.Choose imported high-precision materials (temperature sensor, heater) to control the BGA desoldering and soldering procedures precisely.

2.There are three independent heating areas from top to bottom. The first and second temperature areas can control many groups and sections of temperature parameters at the same time. The third area preheats the PCB thoroughly to achieve the best welding effects.

3.Choose imported high-precision thermocouple to detect top/bottom temperature precisely. With a function of over-heating protection.

4.Top and bottom temperature areas heat independently. A cross-flow fan cools rapidly to protect the PCB from deformation when welding.

5.After finishing desoldering and soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering.

6.use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB.

7.for large thermal capacity of PCB or other high-temperature and lead-free welding requirements, all can be handled easily.
8.we also provide  customized services.

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ZM-R5830 BGA rework station

Specifications

ZM-R5830 BGA rework station
The 1st power hot air in same products.
3 temperature areas.

ZM-R5830 product specifications and technical parameters

1. A total power of 4500W
2 upper heating power 800W
3, the second temperature lower heating power 1200W, the third (IR) temperature 2400W
4 Power AC220V ± 10% 50/60Hz
5 dimensions 530 × 600 × 600mm
6, V-shaped positioning slot, PCB stent X, Y in any direction to adjust and configure the universal fixture
7 K-type thermocouple temperature control (K Sensor) closed-loop control, independent temperature control, accuracy up to ± 3 degrees;
8 PCB dimensions Max 350 × 330mm Min 20 × 20 mm
9, high sensitive temperature control module electrical selection touch screen + Taiwan
10 Weight 34kg

* Product Features:
ZM-R5830 Performance and Characteristics:

1, using a linear slide so that X, Y, Z axis fine tuning can be done or rapid positioning movements with high accuracy and quick maneuverability.

2. machine uses high-definition touch screen, PLC control, users can store multiple sets of temperature profile data. Power-on password protection and modification work the way a curve of temperature data in response to a touch screen display, with a transient curve analysis , comes with USB port, you can download, print, save and analyze the curve.

3. with three independent heating temperature, the upper and lower temperature hot air heating, the bottom temperature infrared heating, precise temperature control within ± 3 degrees, the upper temperature as needed to move freely, both top and bottom heating elements can be multi-zone temperature control settings. IR Preheat Available as per requirement to adjust the output power.

4. the hot air nozzle can be rotated 360 °. The bottom of the PCB board infrared heaters can heat evenly.

5. the selection of high-precision K-type thermocouple loop control, external temperature measurement interface to the temperature of the precision test. PCB board positioning using V-shaped groove, flexible and convenient removable fixture on the PCB board has protective effects against PCB PCB edge of the device damage and deformation, and can adapt to rework BGA package size.

6. using high-power cross-flow fan to cool quickly PCB board to improve efficiency. And built-in vacuum pump, an external vacuum suction pen, convenient and quick to take hold BGA chips.

7. the welding work is completed with alarm function, as a user with special added "early warning" function.

8. the machine through the CE certification, with emergency stop switch and automatic power-off protection device abnormal incidents. In case the temperature control circuit can automatically power off with a double over-temperature protection.

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ZM-R5850C rework station

Specifications

1 4800W total power
2 the upper heating power 800W
3 lower heating power second temperature area 1200W, and the third (IR) temperature area 2700W
The power supply AC220V + 10% 50/60Hz
5 shape dimension 635 x 600 x 560mm
6 localization way v-shape card slot, PCB stents X, Y any direction can be adjusted and configuration universal fixture
7 temperature control K type thermocouple (K) closed-loop control, be independent control temperature, precision can reach + 3 degrees;
8 PCB size 370mm Min 20 Max 410 x x 20 mm
9 machine weight 40kg 

* product features:
ZM - R5850C performance and features:

1. using linear slider make X, Y, Z triaxial all can do fine fine-tuning or rapid positioning action, has high location accuracy and quick maneuverability.

2. the machine adopts high precision temperature control meter, built-in PC serial ports, external temperature measuring interface, with software, can realize the computer control.

3. adopt three temperature area, fluctuation temperature area independent heating air heating, bottom temperature area infrared heating, temperature precise control in + 3 degrees, the upper temperature area visible need to move freely, the second temperature area can be up-down adjustment, top and bottom heaters can also set up more paragraphs to control temperature. IR preheating zone can adjust the output power in accordance with the actual requirements.

4. equipped with various specifications titanium alloy BGA wind mouth, the wind can be 360 degrees of arbitrary rotation mouth, easy to install and replacement, can according to customers' special requirements.

5. selection of high-precision K, outer closed-loop control thermocouple temperature measurement interface implementation on the temperature precision testing. PCB v-shape slot, positioning of the flexible and convenient portable everything on the fixture protect PCB board, prevent PCB edge device injury and PCB deformation, and can adapt to all kinds of BGA encapsulation size of repair.

6. adopt high-power cross-flow fan of PCB quickly for cooling, improve the work efficiency. Meanwhile built-in vacuum pumps, external vacuum pen, with convenient take take BGA chip.

7. welding after work has alarm prompt functions, for the convenience of customers use special increase "early alarm" function.

8. the machine after CE certification, with a sudden stop switch and abnormal accident automatic power protection device. In temperature abuse cases, circuit can automatically without electricity, has dual overtemperature protection function.

9. this machine adopts CCD visual system, the welding and of BGA desoldering the melting process, provide accurate judgement read key visual.

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ZM-R5860 Infrared BGA Rework Station

Specifications

1.ZM-R5860 BGA Rework Station
2.IR Rework Station for laptop,xbox360,mobile
3.easy digital meter
4.connect pc
5.CE

1. Main Features:

1.Adopt liner slide which makes X,Y,Z axis all can do precision adjustment or fast positioning, with high positioning accuracy and fast maneuverability

2.high definition touch screen (Taiwan) , PCL control, can save multiple groups profile, password protection and modify function, and can save multiple groups profile, equipped with instant temperature curve analysis function

3.There are 3 independent heating areas from top to bottom. The 1st and 2nd are hot-air heaters, the 3rd is IR preheating, temperature controlled within ±3 °,Top heater can be adjusted freely, second heater can be adjusted up and down, top and bottom temperature can control many groups and sections of temperature parameters at the same time, he third IR heater can be adjusted the power consumption

4.Offer all kinds of hot-air nozzle, it can rotate 360°,ith magnet, easy to install and change, customized is available, ottom IR heater ensure an even heat for PCB board

5 .Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature.

6. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size

7.powerful cross-flow fan rapidly cool the PCB board to improve efficiency,Also built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly

8.After finishing desoldering & soldering, There is an alarming and alarming in advance

9.CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens,ith a double over-heating protection control 

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ZM-R600C BGA rework equipment

Specifications

BGA rework station ZM-R600C
top hot air and bottom infrared
Touch screen, semi-automatic
Cost effective
CE, ISO passed

BGA rework equipment ZM-R600C Features:

1. Have 7 temperature sections for control such as preheating, insulation, heating, welding 1, welding

2, cooling and refrigeration. The excellent temperature control system ensures the effectiveness of welding.

 2. It can save 1 to 100 groups of graph parameters at one time. It can analyse the graphs and change the settings at any time on the touch screen.

3. There are three independent heating areas from top to bottom. the first and second temperature areas can control many groups & sections of temperature parameters at the same time. The third area preheats the PCB thoroughly to achieve the best welding effect. Temperature, time, slope, cooling and alarming all display on the touch screen.

4. Choose imported high-precision K-Sensor with closed-loop to detect up/down temperature precisely.

5. After finishing desoldering & soldering, there is an alarming. When the temperature goes beyond control, the electric circuit can cut off automatically, with over-heating protection.

 6. Use a powerful cross-flow fan to cool PCB rapidly to prevent it from deformation and ensure the welding effect.

 7. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB.

 8. For large thermal capacity of PCB/CSP or other high-temperature lead-free requirements, all can be handled easily.

9. The hot air nozzle can rotate 360 ° freely and it's easy to replace. Offering BGA nozzles of different sizes for you to replace easily. Nozzles of special requirements are customizable.

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ZM-R680C rework station

Specifications

cheapest motherboard repairing machine
BGA repair solutions
hot air heater welder
touch screen solution
repair machine

ZM-R680C Optical alignment fix motherboard and bga chip solutions

Main task: desoldering-remove chipset-replace-mounting-welding

Working features:

Features :

1. Choose imported high-precision materials (temperature sensor, PLC, heater) to control the BGA desoldering & soldering procedures precisely.

2. Top/bottom temperature areas heat independently and more accurately. The first and second temperature areas can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of graph parameters at the same time. The third area uses far-infrared heater to preheat and control the temperature independently, so that the PCB can be fully preheated during the desoldering process and it can be free from deformation.

3. Choose imported high-precision thermocouple to detect the top/bottom temperature precisely.

4. In the upper part, the heating head and the mount head are designed 2 in 1 to weld and mount automatically.

5. Adopt high-precision auto-place system with enlarge & micro-adjust function. The machine is equipped with a 15° color LCD monitor.

6. After finishing desoldering & soldering, there is an alarming. When the temperature goes beyond control, the electric circuit can cut off automatically, with over-heating protection.

7. The mounting nozzle with a built-in vacuum pump can rotate 45°, and the suction force can be adjusted.

8. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled.

9. Offer BGA nozzles of different sizes to change easily. For large thermal capacity of PCB or other high-temperature and lead-free welding requirements, all can be handled easily.

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ZM-BIP3000

Specifications

BIP3000 ZM - type number:
Specifications and technical parameters:
01 3700W Powerused total power
02 Main Heater 600W upper heating power
03 bottom Heater 3000W Sub heating power
04 210V - Powerused AC power 230V 50Hz + 3
05 L780 Machine configuration dimensions W520 * * * * * H460mm dimension
06 localization way Positioning V type card slot
07 Temperature control Temperature control infrared sensors
08 maximum PCB Size Max. Do 320mm 370 * PCB
09 machine machine Weight of 35 kg Weight

 * product features:
Special point:

1. the repair machine suitable for notebook computer motherboard, desktop computer motherboard, server motherboard, big game such large circuit board maintenance, mainboard motherboard and mobile phone as the maintenance of small small-sized chip.

2. the machine adopts touch human-machine interface, PLC control, always shows three temperature curve, shows three curve is the actual acquisition BGA temperature curve. Make temperature precise control in + 1 degrees.

3. fluctuation heating area chooses import by dynamic infrared heater, the upper outer technology, double really dark closed-loop control technology, whether BGA chip size without replacement wind tsui, convenient, accurate, high efficiency. The upper infrared heater motors automatic fluctuation.

4. upper and lower temperature area, may simultaneously setting independent heating temperature + 6 paragraph 6 paragraph constant temperature control, can also store 50 group temperature setting parameters.

5. using the upper heating and bottom heating temperature curve way, walk alone high-power cross-flow fan, ensure rapid cooling principle in PCB welding process, won't be out of shape.

6. desoldering and welding with alarm functions, completed in temperature abuse cases circuit can automatically without electricity, have overtemperature protection function.

7. for large heat capacity PCB and other high temperature requirements, lead-free solder can easily handle.

8. the shape, structure electromechanical integrated, installation and operation is very convenient

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ZM-R6800 rework station

Specifications

fit for all BGA chip layout on PCB
all sizes nozzles changing
password protection

Motherbord repair ZM-R6800 charming features:

1. Total power: 485W

2. fit for all kinds BGA chips repair on PCB

3. PS3, XBO360,Cellphone,blue earphone , gameboard, computers (laptop or desktop) highly worked out

4.Imported IR heaters take durable, save enegy for granted.

5. Save groups profiles for analyzing, calibrating or somethingelse.

6. Human-machine interface design, high definition touch screen, PLC control, password protection and calibrate function. can save multipl profile, instant curve analysis function

7. Resolution: 800*480

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ZM-R6808

Specifications

R6808 ZM - type number:
BGA repair Taiwan R6808 ZM - this product patent number: 200830219032.6

ZM - R6808 technical parameters

1. 4850W total power
2. the upper heating power 800W
3. lower heating power second temperature area 2700W 1200W, third temperature area\
4. The power supply AC220V + 10% 50/60Hz
5 shape dimension 8.5 x 8.3 x 800 mm
6. localization way letter V scaffolds card slot, PCB X, Y arbitrary direction adjusted
7. Tem. control K type thermocouple (K) closed-loop control, precision can reach + 2 degrees
8. PCB size Max 370 x 45 mm Min 22 x 22 mm
9. electrical material Taiwan touch screen + PLC + Germany fever board + intelligent high-accuracy temp. control module
10. magnification 10x - 100x times
11. contrapuntal system manual control, CCD color high-definition imaging system
12. 80X80mm 1X1 - for chip
13. touch screen resolution 640X480 7.0 trades, PanelVisa diagonal screen, but an external USB interface
14. external temperature measuring port 1 (extensible)
16. placement accuracy X, Y and R Angle adopts micrometer fine-tuning, precision can reach + 0.01 MM
17. machine weight 85kg

 * product features:
R6808 ZM - main performance and features:

1. using linear slider make X, Y, Z triaxial all can do fine fine-tuning or rapid positioning action, has high location accuracy and quick maneuverability.

2. the machine adopts three temperature area independent control temperature, one, two temperature area hot air heating and can make much group more paragraphs temperature control, the third temperature area of PCB large IR bottom overall preheat to ensure uniform, board up coefficient passionate deformation, the heating temperature, time, slope, cooling, alarm all in the screen.

3. with high K type thermocouple closed-loop control and automatic temperature compensation system, combining PLC and temperature module implements accurate control of temperature, maintain temperature deviation in + 2 degrees. Meanwhile external temperature measuring interface implementation on the temperature precision testing, and realize the actual temperature curve accurate analysis and proofreading.

4. PCB positioning of the letter V slot, positioning quick, convenient, accurate, meet different PCB layout mode and the different size PCB positioning.

5. flexible and convenient portable everything on the fixture protect PCB board, prevent PCB edge device injury and PCB deformation, and can adapt to all kinds of BGA encapsulation size of repair.

6. equipped with various specifications titanium alloy BGA wind mouth, the wind can be 360 degrees of arbitrary rotation mouth, easy to install and replacement, the customer designated can make to order, and optional X to infrared laser rapid positioning.

7. GaoQingKe attune, using CCD color optical vision system, a spectral, amplification, fine-tuning, autofocus. And equipped with automatic chromatism distinguish and brightness adjusting device. But manual adjustment imaging clarity.

8. guarantee the premise of magnification unchanged, can control optical lens and moving, all aspects of the four corners of the observational BGA chip to the center of the situation, and eliminate the "vs" pretermission observation blind Angle, images showed clear, X, Y and R Angle adopts micrometer fine-tuning, alignment precision, accuracy is + 0.01 MM, match 15 "of hd LCD monitor, a high degree of automation, completely avoid factitious process error.

9. the machine after CE certification, with a sudden stop switch and abnormal automatic event without electricity protective device.

10. BGA remove, welding finished with voice alarm functions, for the convenience of user use, especially early alarm "add" function. In temperature abuse cases, circuit can automatically without electricity, has dual overtemperature protection function.

11. can store multiple temperature set parameters and memory many groups of different BGA chip to add hot and dot, can in time the touch screen, the temperature parameters curve analysis, setting and fixed.

12. in dismantling, welding finished with large flow transverse fan automatically for PCB for cooling, prevent PCB deformation, ensure welding effect.

13. adopt Taiwan hd touch human-machine interface, PLC control, this password protection and modify functions, but also shows that four temperature curve and storage multiple user data, and have instant curve analysis function.

14. multi-function humanized operate interface, the machine touch screen interface Settings "debugging interface" and "interface", in case the assignments by mistake. The temperature parameters set with password protection, prevent any amendments.

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ZM-R680D BGA Rework station

Specifications

BGA Chips Repair equipmen
suitable for any kind of bga rework
High automatic,Cost effective
CE

 Specifications and technical parameters of ZM-R680D: 
1. Total Power : 5800W
2. Top heater : 1200W
3.  Bottom heater: 2nd  heater 1200W,3rd IR heater 3300W
4.  power:  AC220V±10%     50/60Hz
5.  Dimensions: 720×900×900mm(LCD stand not included)
6.  Positioning: V-groove, PCB support can be adjusted in any direction and with external universal fixture 
7.  Temperature control : K-type thermocouple (Closed Loop), heating independently, temperature precision within ±1 degree
8.  PCB size: Max 380×430mm Min 10×20 mm
9.  Electrical materials: Servo Drive( Panasonic)+Touch screen( Taiwan)+Panasonic PLC+Heating plate(Germany)
10. Camera magnification :10x-100x 
11. Optical system: Joystick control, Motor drive, CCD color high-definition imaging system
12. BGA chip :2×2-80×80mm
13. Touch screen: 7.0inch ,Resolution 640X480, Panel Visa touch screen, external USB interface
14. External temperature sensor four
15.  Work Mode :Power drive
16.  Placement: Accuracy X, Y axis and the R angle with micrometer adjust, accuracy within ± 0.01MM
17.  Net weight :80KG

ZM-R680D  Main Features:
1.  Panasonic servo drives, joystick control, micrometer adjustment, X-shaped infrared laser positioning ,6-8 Rapid heating and cooling settings, automatic feeding and feeding systems are optional

2.  There are 3 independent heaters,The 1st and 2nd hot-air heaters can control multiple groups and segments temperature parameters, The 2nd heater can move up and down, The 3rd large area IR heater can preheat the PCB board fully to ensure no deformation to the board    Temperature, time, slope, cooling, alarming all can be displayed on the touch screen

3.  High-precision K-type thermocouple with closed loop control, automatic temperature compensation system, combined with Panasonic PLC and highly sensitive temperature module for the precise temperature control, the temperature error controlled within ± 1 degree,The external 4 sensors can detect temperature precisely, analyze and calibrate the real temperature curve accurately

4.  V-groove PCB support, rapid positioning, convenience, accuracy, can fit for all kinds of PCB board

5.  Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of BGA repair

6. The top heater device and mounting head 2 in 1 design and ball screw drive, Z-axis movements are controlled by Panasonic servo system which can accurately control the site and hotspots,with different size alloy BGA nozzles, 360 degree rotation, easy to install and replace, customized is available

7. High-definition CCD color optical vision system, splitting, amplification, micro-adjust and auto-focus, With automatic color resolution and brightness adjustment device, it can adjust the definition of the image automatically

8. Without changing the magnification, the optical lens can be moved manually left and right, back and forth freely,It can observe all aspects of the BGA chip, It displays clearly,The X, Y axis and R angle with micrometer adjust, precise positioning, alignment accuracy is within ± 0.01MM, 15 inch TFT LCD Monitor

9. CE certification, with emergency switch and automatic power-off protection device when emergency happens, With protective mesh to prevent components falling or human burns happen

10. Mounting, welding and dewelding process are intelligent controlled and work automatically, BGA mounting position is controlled accurately,after finishing desoldering and soldering, there is alarming, When temperature goes out of control, the circuit w automatically power off

11. It can save multiple groups profiles, You can analyze, set and calibrate the temperature parameters curve on the screen at any time,You can print, save and analyze the curve through the USB port without other external devices (such as computer)

12.  powerful cross-flow fan to cool the PCB board automatically after desoldering and soldering, it can prevent the deformation of PCB board to ensure the welding effect

13. human-machine interface, high-definition touch screen(Taiwan), PLC control, password protection and calibrate function, can show seven temperature curves and save multiple profiles, instant curve analysis function

14.  With Multifunctional and humanized operation interface, there is set up Interface and  operation interface  on the touch screen to prevent wrong operations and setting,Temperature parameter has password protection to stop arbitrary changes

15.   After finishing desoldering and soldering with a double over-temperature protection, there is alarming,When temperature goes out of control, the circuit automatically power off

16.   This machine is equipped with pressure and optical sensors,to control the pressure in 3-10 grams and optical switches, so that it can automatically recognize the suction chip and mounting height, to ensure not crush BGA chip, It can repair Socket775 and double BGA / CGA / IC and various shielding devices, meet the requirement of lead-free process.

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ZM - R6810 rework station

Specifications

BGA repair computers

ZM - R6810 technical parameters:
1 6750W total power
2 1200W upper heating powerA
3 lower heating power second temperature area 4200W 1200W, third temperature area
The power supply AC220V + 10% 50/60Hz
5 shape dimension 900 x 320 x 900 mm
6 localization way letter V scaffolds card slot, PCB X, Y arbitrary direction adjusted and matchs outside universal fixture
7 temperature control K type thermocouple (K) closed-loop control, be independent control temperature, precision can reach + 2 degrees;
8 PCB size Max 450mm Min 10 x 400 x 20 mm
9 electrical material control motor + Taiwan touch screen + panasonic PLC + Germany fever board
10 magnification 10x - 100x times
11 contrapuntal system Japan packs CCD color high-definition imaging system, manual control
12 80X80mm applicable chip
13 touch screen resolution 640X480 7.0 trades, PanelVisa diagonal screen, but an external USB interface
14 external temperature measuring port 4
15 working way electric drive (optional gas driving + nitrogen)
16 placement accuracy X, Y and R Angle adopts micrometer fine-tuning, precision can reach + 0.01 MM
17 machine weight 85kg

* product features:
R6810 ZM - main performance and features:

1. the machine adopts three temperature area independent control temperature, one, two temperature area hot air heating and can make much group more paragraphs temperature control, the third temperature area of PCB large IR bottom overall preheat to ensure uniform, board up coefficient passionate deformation, the heating temperature, time, slope, cooling, alarm all in the screen.

2. with high K type thermocouple closed-loop control and automatic temperature compensation system, and combined with panasonic PLC and temperature module implements accurate control of temperature, maintain temperature deviation in + 2 degrees. Meanwhile external 4-5 temperature measuring interface implementation on the temperature precision testing, and realize the actual temperature curve accurate analysis and proofreading.

3. PCB positioning of the letter V slot, positioning quick, convenient, accurate, meet different PCB layout mode and the different size PCB positioning.

4. flexible and convenient portable everything on the fixture protect PCB board, prevent PCB edge device injury and PCB deformation, and can adapt to all kinds of BGA encapsulation size of repair.

5. the upper heating device and mounted head integration design, screw transmission, the Z axis movement for accurate control motor control, can add hotspot for sites with a variety of specifications. Equipped with titanium BGA wind mouth, the wind can be 360 degrees of arbitrary rotation mouth, easy to install and replacement, the customer designated can make to order, and optional X to infrared laser rapid positioning.

6. using GaoQingKe adjustable CCD color optical vision system, a spectral, amplification, fine-tuning, af function. And equipped with automatic chromatism distinguish and brightness adjusting device. But manual adjustment imaging clarity.

7. during the guarantee in the premise of magnification unchanged, can control the optical lens move around, all the aspects of the four corners of the observational BGA chip to the center of the situation, and eliminate the "vs" pretermission observation blind Angle, images showed clear, X, Y and R Angle adopts micrometer fine-tuning, alignment precision, accuracy is + 0.01 MM, match 15 "of hd LCD monitor, a high degree of automation, completely avoid factitious process error.

8. the machine after CE certification, with a sudden stop switch and abnormal accident automatic power protection devices. And add a titanium defend net, prevent burns manpower and objects fall.

9. mounted, welding, remove process realizes intelligent control, it can automatic mounted, welding, disassemble. BGA mounted position control accurate. BGA remove, welding finished with voice alarm functions, in temperature abuse cases, circuit can automatically without electricity, has dual overtemperature protection function.

10. can store multiple temperature set parameters and memory many groups of different BGA chip to add hot and dot, can in time the touch screen, the temperature parameters curve analysis, setting and fixed. Also can be equipped with the machine does not need to rely on external devices (computer) can through bringing USB port to download, print, save and analysis curves.

11. in dismantling, welding finished with large flow constant-current fan automatic for PCB for cooling, prevent PCB deformation, ensure welding effect.

12. adopt Taiwan hd touch human-machine interface, PLC control, this password protection and modify functions, but also shows that seven temperature curve and storage multiple user data, and have instant curve analysis function.

13. multi-function humanized operate interface, the machine touch screen interface Settings "debugging interface" and "interface", in case the assignments by mistake. The temperature parameters set with password protection, prevent any amendments.

14. the machine is equipped with pressure sensor and optical sensors, through the pressure sensor and photoelectric switches make pressure control in 3 to 10 grams of tiny range, allowing it to automatically identify absorb charge and mounted height. To ensure that don't crush the BGA chip to lead-free. Can Socket775 and double BGA/CGA outlets/IC and shields to devices such as repair, demand lead-free process. 

ZM - R6810 technical parameters:
1 6750W total power
2 1200W upper heating power
3 lower heating power second temperature area 4200W 1200W, third temperature area
The power supply AC220V + 10% 50/60Hz
5 shape dimension 900 x 320 x 900 mm
6 localization way letter V scaffolds card slot, PCB X, Y arbitrary direction adjusted and matchs outside universal fixture
7 temperature control K type thermocouple (K) closed-loop control, be independent, precision temperature control

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Vision ZM-R6821 Bga rework station

 Specifications

1 Power consumption 5800W
2 Top heater 800W
3 Bottom heater Infrared plate 4200 W - Nozzle 800 W
4 Power requirement Single phase AC 220V ± 10% - 50 Hz �5.8 kVA
5 Dimensions L800×W700×H1000mm
6 Positioning V-clip PCB clamping | 10~20 μm X-Y table adjust.
7 Temperature control Imported K-type thermocouple (Closed Loop)  ±3-5°C
8 PCB size 22×22mm to 400×450mm
9 Camera magnification 10x to 100x
10 Weight 130 kg

Features:Features:
1. This touch screen controlled desktop rework station is the most compact of our high range equipment. Password protects the data. The temperature profile chart can show 7 profiles at any time.

2. With 5 high precision thermocouple, the temperature can be precisely controlled within a 2°C range by the PLC.


3. With 6 programmable temperature zones, preheat, ramp up, reflow, solidification and cooling can be precisely adjusted.

4. 100 profiles can be recorded within the machine and flexibly created and modified through the touch screen interface.

5. Heating and placing head’s unique combined design, allows flawless placing and soldering. X,Y and Z axis are driven by step-motors. The software can remember 100 groups of coordinates.

6. The 3 temperature zones are controlled independently by the software. Preheating the PCB with infrared plates can avoid deformation and guarantees precision of soldering.

7. Use a powerful cross-flow fan to cool PCB rapidly to prevent it from deformation and ensure the welding effect.

8. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB.

9. The touch screen controls the upper heating system and the optical device. Is is very easy to operate.

10. The top and bottom heating head can move freely on the infrared plate so that BGA can be repaired on different areas of PCB.

11. The machine is equipped with Japan imported vacuum pump.

12. The CCD camera can simultaneously observe the component picked up by the nozzle and the pad on the PCB. The color sensitive focal positioning system can achieve a matching accuracy of 10 to 20 µm.

13. The operator can supervise the process on a split screen 17�monitor.

14. The high degree of automation achieved with this model minimizes the risk of human error.

15. This equipment completely meets the requirements of lead-free process.

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ZM-R8650 BGA chip repair machine

Specifications

desoldering&soldering
auto vision alignsystem
store1000groups tem.para.setting.
1000 heating&positioning memory
Lead free p

features:

1. Industrial computer control, full automatic vision alignment system acquire BGA&PCB image by CCD camera complete positioning. all analysis work automatically.fast response, accuracy is up to0.005MM

2. Equipped with keyboard,mouse and 15''HD LCD monitor.

3. During mounting, the machine can automatically analyze, search,modify the BGA&PCB location, through thenozzle toautomatically pick up BGA and mount it to the specialpad; when desoldering, it can automatically remove and place it to the pointed place.

4.UPPER head movable, X,Y,Z axis controled by Panasonic Servo control system;optical alignment 360degree rotation. automatic error correction system make sure the PIN bit on BGA and PCB pad fully matched.

5. Mounting speed can be controlled according to real work requirements.

6. Huge IR preheater areas, output adjustable, so make sure enegy save and work great.

7. suitble for all BGA repair

8. Mounting, desoldering and soldering process are controlled automatically,

9. store and memorized 1000 groups temperature parameters of BGA chips positioning balls and sites.

10. NW:400KG   Dimensions:110*130*170CM

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